DocumentCode
3231052
Title
Statistical mixed Vt allocation of body-biased circuits for reduced leakage variation
Author
Jeong, Jinseob ; Paik, Seungwhun ; Shin, Youngsoo
Author_Institution
KAIST, Daejeon
fYear
2008
fDate
21-24 March 2008
Firstpage
629
Lastpage
634
Abstract
Leakage current is susceptible to variation of transistor parameters and environment such as temperature, which results in wide spread in leakage distribution. The spread can be reduced by employing body biasing: reverse body bias for too leaky dies and forward body bias for too slow dies. We investigate body biasing of mixed Vt circuits. It is shown that the conventional body biasing has limitation in reducing leakage variation of mixed Vt circuits. This is because low- and high-l/t devices do not track each other and their body biasing sensitivities are different. We present alternative body biasing scheme that targets compensating die-to-die variation of low Vt. Under this body biasing scheme, within-die profiles of low- and high-l/t, which we need for statistical allocation of mixed Vt, get wider thus become different from the original ones. We present an analytical procedure to derive new within-die profiles. Experiments with 45-nm predictive model show that the spread in leakage distribution (ratio of maximum and minimum leakage) can be reduced to 4.5 as opposed to 9.4 from conventional body biasing on mixed Vt circuits.
Keywords
leakage currents; transistors; voltage distribution; body biasing; body-biased circuit; die-to-die variation; forward body bias; leakage distribution; mixed circuit; predictive model; reduced leakage variation; reverse body bias; statistical mixed allocation; threshold voltage; transistor parameter variation; within-die profile; CMOS technology; Circuits; Delay; Energy consumption; Leakage current; Subthreshold current; Target tracking; Temperature distribution; Threshold voltage; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2008. ASPDAC 2008. Asia and South Pacific
Conference_Location
Seoul
Print_ISBN
978-1-4244-1921-0
Electronic_ISBN
978-1-4244-1922-7
Type
conf
DOI
10.1109/ASPDAC.2008.4484028
Filename
4484028
Link To Document