• DocumentCode
    3231124
  • Title

    Novel high efficiency broadband Ku band power combiner

  • Author

    Wu, Danyu ; Chen, Xiaojuan ; Chen, Gaopeng ; Liu, Xinyu

  • Author_Institution
    Inst. of Microelectron., Chinese Acad. of Sci., Beijing, China
  • fYear
    2010
  • fDate
    8-11 May 2010
  • Firstpage
    258
  • Lastpage
    261
  • Abstract
    High power solid-state power amplifiers require a high efficiency power dividing/combining structure to keep the power loss as low as possible. The heat sinking capability of the divider/combiner also limits its maximum output power with continues wave (CW) configuration. In this paper, we introduce a novel 8-way Ku band power divider/combiner system, it demonstrate advantages of low loss, broadband and good heat sinking capability simultaneously. As its sub-components, low loss probes for waveguide-to-microstrip transition and low loss broadband 1-to-2 power combiners are designed and fabricated. The measured back-to-back insertion loss of the whole 8-way power combiner is lower than 0.5dB in the whole Ku band, and the corresponding combining efficiency is as high as 94.5%. The simulated thermal resistance of the system is as low as 0.2°C/W, indicating the proposed power combiner is able to produce 50W of CW output power with commercial available Monolithic Microwave Integrated Circuits (MMICs).
  • Keywords
    MMIC; heat sinks; microstrip transitions; power amplifiers; power combiners; waveguide transitions; 8-way power combiner; Ku band; continues wave configuration; heat sinking capability; insertion loss; monolithic microwave integrated circuits; power 50 W; power loss as; solid-state power amplifiers; thermal resistance; waveguide-to-microstrip transition; Broadband amplifiers; Cogeneration; Heat sinks; High power amplifiers; MMICs; Power amplifiers; Power combiners; Power generation; Solid state circuits; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Millimeter Wave Technology (ICMMT), 2010 International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-5705-2
  • Type

    conf

  • DOI
    10.1109/ICMMT.2010.5524923
  • Filename
    5524923