• DocumentCode
    3231363
  • Title

    High frequency single element transducer based on pad-printed lead-free piezoelectric thick films

  • Author

    Levassort, F. ; Gregoire, Jean ; Lethiecq, Marc ; Astafiev, K. ; Nielsen, Larry ; Lou-Moeller, Rasmus ; Wolny, W.W.

  • Author_Institution
    UMRS Imagerie & Cerveau, Francois-Rabelais Univ., Tours, France
  • fYear
    2011
  • fDate
    18-21 Oct. 2011
  • Firstpage
    848
  • Lastpage
    851
  • Abstract
    A transducer for medical imaging was fabricated using a pad-printing process to deposit a curved lead-free thick film (KNN-based) on an electroded backing (porous KNN). First, the electromechanical properties of the pad-printed thick film were measured. An effective thickness coupling factor of 34% (similar to those obtained with the same composition by a screen-printing process) was obtained. The transducer has a f-number of 1.3 and a focal distance around 5 mm. The center frequency is at 12 MHz and the -dB bandwidth is 93% and a high sensitivity is observed. For the first time, images of human skin in vivo were obtained using a lead-free film. They are compared to those obtained with a PZT-based transducer.
  • Keywords
    biomedical ultrasonics; high-frequency effects; image resolution; medical image processing; piezoelectric thin films; piezoelectric transducers; porous materials; potassium compounds; sensitivity; skin; sodium compounds; ultrasonic imaging; ultrasonic transducers; (K0.5Na0.5)NbO3; PZT-based transducer; electroded backing; electromechanical properties; frequency 12 MHz; high-frequency single element transducer; human skin; medical imaging; pad-printed lead-free piezoelectric thick films; porous materials; screen-printing; sensitivity; thickness coupling factor; Acoustics; Electrodes; Impedance; Lead; Substrates; Thick films; Transducers; high frequency; lead-free; pad-printing; piezoelectricity; thick film; transducer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2011 IEEE International
  • Conference_Location
    Orlando, FL
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4577-1253-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2011.0207
  • Filename
    6293483