• DocumentCode
    3231968
  • Title

    Design and modeling of MEMS resonator for magnetic field sensing using hybrid actuation technique

  • Author

    Ahmad, Farooq ; Dennis, John Ojur ; Hamid, Nor Hisham ; Khir, Mohd Haris Md ; Ahmed, Abdelaziz Yousif

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Univ. Teknol. Petronas, Tronoh, Malaysia
  • fYear
    2010
  • fDate
    6-9 Dec. 2010
  • Firstpage
    827
  • Lastpage
    830
  • Abstract
    A novel design of 0.751MHz MEMS resonant magnetic field sensor of mass 0.775pg based on hybrid actuation technique (Lorentz force and Electrostatic force) is presented and simulated using Coventor Ware and CADENCE simulators. The sensor consists of Aluminum paddle resonator, two supporting beams, driving electrodes, sensing electrode and silicon substrate with a capacitive CMOS readout amplifier. Working in a resonant condition, the sensor´s vibration amplitude is converted into the sensing capacitance change, which reflects the outside magnetic flux-density. Based on the simulation, the key structure parameters are optimized and the resonant frequency is estimated. The results of the device are in accordance with the theoretical results of the designed model. The resolution of the sensor is 1 nT. The results indicate its sensitivity more than 0.01 nV/nT, when operating at a normal atmosphere. The sensitivity and resolution can be enhanced through vacuum packaging.
  • Keywords
    CMOS integrated circuits; elemental semiconductors; magnetic field measurement; magnetic sensors; micromechanical resonators; silicon; CADENCE simulators; Coventor Ware; Lorentz force; MEMS resonant magnetic field sensor; MEMS resonator; Si; aluminum paddle resonator; capacitive CMOS readout amplifier; driving electrodes; electrostatic force; frequency 0.751 MHz; hybrid actuation technique; magnetic field sensing; magnetic flux density 1 nT; magnetic flux-density; resonant condition; resonant frequency; sensing capacitance change; sensing electrode; silicon substrate; supporting beams; vacuum packaging; vibration amplitude; CMOS integrated circuits; CMOS technology; Damping; Magnetic resonance; Magnetomechanical effects; Micromechanical devices; Weaving; CMOS technology; Electrostatic actuation; Lorentz force; MEMS Resonator; Magnetic sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (APCCAS), 2010 IEEE Asia Pacific Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4244-7454-7
  • Type

    conf

  • DOI
    10.1109/APCCAS.2010.5775024
  • Filename
    5775024