• DocumentCode
    3232372
  • Title

    Statistical leakage power modelling of manufacturing process variations at system level

  • Author

    Chenxi Ni ; Al Tarawneh, Z. ; Russell, G. ; Bystrov, Alex

  • Author_Institution
    MSD Group, Newcastle Univ., Newcastle upon Tyne, UK
  • fYear
    2012
  • fDate
    18-20 Sept. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Process variation has become a major issue in system performance estimation as the technology feature size continues to decrease. This paper proposes a statistical methodology to bring the process variation effects from process level up to system level in terms of circuit leakage power dissipation. A cell library has been built which offers a rapid analysis of process variation effects on system leakage power performance. As a demonstration vehicle for this technique, the leakage power distribution of a micropipeline circuit has been simulated using this cell library. The experimental results show that the proposed method is much faster than the traditional statistical power analysis (SPA) approach by a factor of 150; the results are also compared with Monte Carlo simulation data for validation purposes, and show an acceptable error rate of within 5% and in most cases less than 3%.
  • Keywords
    Monte Carlo methods; manufacturing processes; statistical analysis; Monte Carlo simulation data; cell library; circuit leakage power dissipation; error rate; leakage power distribution; manufacturing process variations; micropipeline circuit; statistical leakage power modelling; statistical methodology; statistical power analysis; system leakage power performance; system level; system performance estimation; Analytical models; Integrated circuit modeling; Libraries; Logic gates; MOS devices; Mathematical model; Semiconductor process modeling; leakage power; process variation; systeme level modelling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Engineering and Automation Conference (PEAM), 2012 IEEE
  • Conference_Location
    Wuhan
  • Print_ISBN
    978-1-4577-1599-0
  • Type

    conf

  • DOI
    10.1109/PEAM.2012.6612432
  • Filename
    6612432