DocumentCode
3232394
Title
Simulation of gas flow and heat transfer in micro Poiseuille flow
Author
Bao, Fu-bing ; Lin, Jian-zhong ; Shi, Xing
Author_Institution
Dept. of Mech., Zhejiang Univ., Hangzhou
fYear
2008
fDate
6-9 Jan. 2008
Firstpage
103
Lastpage
107
Abstract
The gas flow and heat transfer characteristics in micro Poiseuille flow in slip and transition regime were studied numerically using two methods: direct simulation Monte Carlo (DSMC) method and the Burnett equations. The traditional mathematical model of the Navier-Stokes equations becomes invalid because of their linear constitutive relations of viscous stress and heat flux. The molecule based DSMC method is widely used in transition flow regime and has achieved great success. The high- order continuum model of the Burnett equations is recently introduced to simulate the flow in small devices. These two methods are both adopted in the present study and they show good agreement with each other. But DSMC method is more expensive in computational time. The flow and heat transfer characteristics of Poiseuille flow in microchannels are then studied. It is found that with the increase of Knudsen number, the Poiseuille number decreases while Nusselt number increases. The local Poiseuille number decreases along the whole channel while the local Nusselt number decreases rapidly first and then increases slowly afterwards.
Keywords
Knudsen flow; Monte Carlo methods; Navier-Stokes equations; Poiseuille flow; flow simulation; heat transfer; microchannel flow; Knudsen number; Navier-Stokes equations; direct simulation Monte Carlo method; gas flow simulation; heat transfer; microchannels Poiseuille flow; Boltzmann equation; Computational modeling; Fluid flow; Heat engines; Heat transfer; Mathematical model; Micromechanical devices; Monte Carlo methods; Navier-Stokes equations; Stress; Burnett equations; DSMC method; MEMS; Poiseuille flow; numerical simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location
Sanya
Print_ISBN
978-1-4244-1907-4
Electronic_ISBN
978-1-4244-1908-1
Type
conf
DOI
10.1109/NEMS.2008.4484296
Filename
4484296
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