• DocumentCode
    3232894
  • Title

    Design of surface acoustic wave filters using layer diamond structures with zero temperature coefficient of delay

  • Author

    Ro, Ruyen ; Lee, Ru-Yue ; Sung, Chia-Chi ; Wu, Sean ; Liao, Yen-Hsun

  • Author_Institution
    Dept. of Electr. Eng., I-Shou Univ., Kaohsiung, Taiwan
  • fYear
    2011
  • fDate
    18-21 Oct. 2011
  • Firstpage
    92
  • Lastpage
    95
  • Abstract
    The (100) ZnO/Cu IDTs/(100) AlN/diamond structures is presented in this study to retain a zero temperature coefficient of delay (TCD) along with a larger coupling coefficient and a higher phase velocity such that it can be employed to design wide-band RF filters for the long term evolution (LTE) wireless communication applications. With the optimized AlN and ZnO films thickness ratio of 3.333 and 0.17, and Cu electrode thickness ratio of 0.093, respectively, Sezawa mode in the (100) ZnO/Cu IDTs/(100) AlN/diamond structures possesses the phase velocity of 5672.05 m/s, coupling coefficient of 6.97%, and reflectivity of 0.15. The tailored ladder filter using these coupling-of-mode (COM) parameters yields a RF filter operating at 2535 MHz with 2.1 dB bandwidth of 74.2 MHz, insertion loss of 0.765 dB, and sidelobe suppression of 55.6 dB.
  • Keywords
    II-VI semiconductors; aluminium compounds; copper; diamond; electrodes; reflectivity; surface acoustic wave filters; wide band gap semiconductors; zinc compounds; Sezawa mode; ZnO-Cu-AlN-C; coupling coefficient; coupling-of-mode parameters; electrode; films; frequency 2535 MHz; insertion loss; interdigital transducer; layer diamond structures; long term evolution wireless communication applications; phase velocity; reflectivity; sidelobe suppression; surface acoustic wave filters; tailored ladder filter; wide-band RF filters; zero temperature coefficient-of-delay; Couplings; Diamond-like carbon; Films; Surface acoustic wave devices; Surface acoustic waves; Zinc oxide; AlN; COM; LTE; TCD; ZnO; diamond; filter;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2011 IEEE International
  • Conference_Location
    Orlando, FL
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4577-1253-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2011.0023
  • Filename
    6293562