DocumentCode
3233082
Title
Investigation of SNM with Random Dopant Fluctuations for FD SGSOI and FinFET 6T SOI SRAM Cell by Three-dimensional Device Simulation
Author
Tanabe, R. ; Ashizawa, Y. ; Oka, H.
Author_Institution
Fujitsu Labs. Ltd., Tokyo
fYear
2006
fDate
6-8 Sept. 2006
Firstpage
103
Lastpage
106
Abstract
As CMOS technology is dramatically scaled down in recent years, the operation of SRAM becomes one of critical issues for further scaling. In this paper, we have focused on both FD SGSOI and DG (FinFET) devices because of the scaling capabilities, and we have simulated SRAM SNM with discrete dopant fluctuations in the channel regions by 3D simulation. As for SNM, FinFET is a promising candidate up to 32 nm node, but for 22 nm node, it will be difficult to operate even a FinFET with stability. As for fluctuations, the total number of dopant in channel depletion layer is a key factor. The fluctuations of SNM in FinFET are reduced by balancing fin thickness and dopant density in the channel
Keywords
CMOS memory circuits; MOSFET; SRAM chips; fluctuations; integrated circuit modelling; integrated circuit noise; semiconductor doping; silicon-on-insulator; technology CAD (electronics); CMOS technology; FD SGSOI; FinFET 6T SOI SRAM cell; SNM; TCAD; channel depletion layer; dopant density; random dopant fluctuations; static noise margin; three-dimensional device simulation; Boron; CMOS technology; Circuit simulation; Computational modeling; Databases; FinFETs; Fluctuations; MOS devices; Poisson equations; Random access memory; 3D simulation; FDSOI; FinFET; SRAM; Static Noise Margin; TCAD; component; fluctuation; scaling;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2006 International Conference on
Conference_Location
Monterey, CA
Print_ISBN
1-4244-0404-5
Type
conf
DOI
10.1109/SISPAD.2006.282848
Filename
4061591
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