Title :
Thermal analysis and design of a micro-hotplate for Si-substrated micro-structural gas sensor
Author :
Tao, Chunmin ; Yin, Chenbo ; He, Maoxian ; Tu, Shandong
Author_Institution :
Sch. of Mech. & power Eng., Nanjing Univ. of Technol., Nanjing
Abstract :
There is considerable interest in decreasing the power consumption of available semiconductor metal oxide gas sensors. The low-voltage and low-power consumption metal oxide gas sensors can be easily produced by combining micromachining and thin-film technologies. The concept of micro-hotplate is one of the possible solutions. Considering of the thermal resistant and sensitive characteristics of metal platinum, as well as the heat and electricity insulating characteristics of SiO2 and SiNx , a kind of the Si-substrated micro-hotplate gas sensor was designed. Platinum filament was used as heater and temperature sensor, including SiO2 and SiNx was used as thermal and electricity insulation respectively. Then the temperature distribution of the Si-substrated micro-hotplate gas sensor was simulated and analyzed by the finite element analysis(FEA) tool ANSYS. In order to make the gas sensor obtain perfect properties of lower power and higher response speed, gas sensor was ameliorated by the result of analysis.
Keywords :
electric heating; finite element analysis; gas sensors; microsensors; platinum; silicon compounds; temperature distribution; thermal analysis; thermal insulation; thermal resistance; FEA; SiN; SiO2; electricity insulation; finite element analysis; heater; metal platinum; micro-hotplate; microstructural gas sensor; platinum filament; temperature distribution; temperature sensor; thermal analysis; thermal insulation; thermal resistance; Dielectrics and electrical insulation; Energy consumption; Gas detectors; Gas insulation; Micromachining; Platinum; Resistance heating; Semiconductor thin films; Thermal resistance; Thin film sensors; Micro-Hotplate; Si-substrated; finite element anslysis;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location :
Sanya
Print_ISBN :
978-1-4244-1907-4
Electronic_ISBN :
978-1-4244-1908-1
DOI :
10.1109/NEMS.2008.4484336