DocumentCode
323317
Title
Hybrid feedforward and feedback control of wafer temperature in RTP using genetic algorithm and fuzzy logic
Author
Hwang, Min Woong ; Choi, Jin Young
Author_Institution
Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Volume
1
fYear
1997
fDate
28-31 Oct 1997
Firstpage
93
Abstract
This paper proposes a hybrid controller design method using the genetic algorithm and the fuzzy logic to control the wafer temperature in RTP system. First, we design feedforward static controller to provide the control powers of the lamps for the given steady state temperature. Second, the feedforward dynamic controller is designed for the additional control powers to achieve a given transient response. These feedforward controllers are implemented by using the fuzzy logic to act as global nonlinear controller over a wide range of operating points. The parameters of these controllers are optimized by using genetic algorithm so that it can be used when the mathematical model is not available. In addition. A feedback controller is introduced to compensate the feedforward controllers when there exist disturbances and modeling errors. The gain of feedback controller is also obtained by means of genetic algorithm. Through simulations, we verify that the proposed control system can give a satisfactory performance
Keywords
computerised control; feedback; fuzzy logic; genetic algorithms; intelligent control; rapid thermal processing; temperature control; transient response; feedback control; feedback controller; feedforward static controller; fuzzy logic; genetic algorithm; global nonlinear controller; hybrid controller design method; hybrid feedforward control; mathematical model; rapid thermal processing; transient response; wafer temperature; Adaptive control; Control systems; Design methodology; Feedback control; Fuzzy logic; Genetic algorithms; Lamps; Nonlinear dynamical systems; Steady-state; Temperature control;
fLanguage
English
Publisher
ieee
Conference_Titel
Intelligent Processing Systems, 1997. ICIPS '97. 1997 IEEE International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4253-4
Type
conf
DOI
10.1109/ICIPS.1997.672745
Filename
672745
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