Device Performance and Package Induced Self Heating Effects At Cryogenic Temperatures

As electronics that can work in space find wider applications, the modeling of devices that can efficiently operate under extreme conditions has been gaining great importance. Thus, we present a methodology for determining device performance details at cryogenic temperatures in conjunction with chip and package details. Using our technique that takes into account package thermal resistances and generated heat, we obtain possible temperature operating conditions for a device used in space applications. Moreover, to enable device operation at higher temperatures that would result in higher transconductances and operating speeds, we also offer methods for initial temperature boosting using heat kick-start circuits