Flow Simulation: Advanced Dielectric Etch Equipment Design and Process Development

With shrinkage in device size, use of new materials in multiple layers, and larger wafer size, control of process uniformity across the wafer becomes crucial in semiconductor manufacturing. Flow simulation has been used to design advanced dielectric etch equipment to achieve better flow uniformity. The ability to tune flow uniformity helped us to achieve various desired process characteristics, such as CD bias, profile, and etch stop across the wafer