Scattering parameters analysis of the vertical Interconnected via in microwave multilayer circuits

Author

Tian, Yu ; Liu, Yu ; Tong, Ling

Author_Institution

Coll. of Autom. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China

fYear

2010

fDate

8-11 May 2010

Firstpage

775

Lastpage

778

Abstract

The paper presents the scattering parameters analysis of the vertical Interconnected vias in microwave multilayer circuits. The vertical Interconnected vias can be divided into two parts which are known as the exterior structure and the interior structure and whose scattering parameters can be analyzed separately by the matrix-penciled moment method (MP-MOM)and the equivalent impedance method in parallel planes. The general design rules have been summarized about vertical Interconnected vias in microwave multilayer circuits in the paper.

Keywords

S-parameters; method of moments; microwave circuits; multilayers; design rules; equivalent impedance method; matrix-penciled moment method; microwave multilayer circuit; parallel planes; scattering parameters analysis; vertical interconnected via; Automation; Educational institutions; Frequency; Integrated circuit interconnections; Microwave circuits; Moment methods; Nonhomogeneous media; Printed circuits; Scattering parameters; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Millimeter Wave Technology (ICMMT), 2010 International Conference on

Conference_Location

Chengdu

Print_ISBN

978-1-4244-5705-2

Type

conf

DOI

10.1109/ICMMT.2010.5525065

Filename

5525065