DocumentCode :
3234305
Title :
Analysis of edge effects in the mesa isolated nMOS SOI
Author :
Tseng, Y.-C. ; Collett, J. ; Vu, T.O. ; Cable, J.S. ; Woo, J.C.S.
Author_Institution :
California Univ., Los Angeles, CA, USA
fYear :
1996
fDate :
30 Sep-3 Oct 1996
Firstpage :
90
Lastpage :
91
Abstract :
Uses both I-V measurements and charge pumping methods to investigate the sidewall edge effects in mesa isolation. There are two major issues that have to be solved related to edge effects in the mesa. One is the `hump´ in I-V characteristics which can be solved by a tilt field implant. The other issue is the extra interface states along the sidewall which does not scale linearly with channel length. Therefore, in deep submicron devices, the extra interface states can become the same order of magnitude as the interface states from the channel. As a result of the noise from the extra interface states, application of mesa isolation to SOI CMOS on analog circuits needs further optimization
Keywords :
CMOS analogue integrated circuits; MOSFET; VLSI; characteristics measurement; integrated circuit measurement; integrated circuit noise; integrated circuit technology; interface states; isolation technology; silicon-on-insulator; I-V measurements; SOI CMOS; analog circuits; charge pumping methods; deep submicron devices; interface states; mesa isolated nMOS SOI; noise; sidewall edge effects; tilt field implant; CMOS technology; Charge measurement; Charge pumps; Circuits; Current measurement; Implants; Interface states; MOS devices; Pulse measurements; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1996. Proceedings., 1996 IEEE International
Conference_Location :
Sanibel Island, FL
ISSN :
1078-621X
Print_ISBN :
0-7803-3315-2
Type :
conf
DOI :
10.1109/SOI.1996.552508
Filename :
552508
Link To Document :
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