• DocumentCode
    3234486
  • Title

    Monte Carlo Simulation of Boron Implantation into (100) Germanium

  • Author

    Wittmann, R. ; Hossinger, A. ; Cervenka, J. ; Uppal, S. ; Selberherr, S.

  • Author_Institution
    Inst. for Microelectron., TU Wien
  • fYear
    2006
  • fDate
    6-8 Sept. 2006
  • Firstpage
    381
  • Lastpage
    384
  • Abstract
    We present a Monte Carlo simulation study for introducing boron ions into Ge in the energy range from 5 to 40 keV. The successful calibration of our ion implantation simulator for crystalline Ge is demonstrated by comparing the predicted boron profiles with SIMS measurements. The generation of point defects are calculated with a modified Kinchin-Pease damage model. An implanted boron profile in Ge is shallower than in Si for any given energy due to the larger nuclear and electronic stopping power of Ge atoms. We found that the higher displacement energy in Ge, the stronger backscattering effect, and the smaller energy transfer from the ion to the primary recoil of a collision cascade are mainly responsible for the significantly reduced damage in Ge
  • Keywords
    Monte Carlo methods; backscatter; boron; calibration; elemental semiconductors; energy loss of particles; germanium; ion implantation; point defects; semiconductor device manufacture; 5 to 40 keV; Ge:B; Kinchin-Pease damage model; Monte Carlo simulation; backscattering effect; boron implantation; calibration; collision cascade; electronic stopping power; germanium; ion implantation simulator; point defect; Atomic measurements; Backscatter; Boron; Calibration; Crystallization; Germanium; Ion implantation; Nuclear electronics; Nuclear power generation; Predictive models;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2006 International Conference on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    1-4244-0404-5
  • Type

    conf

  • DOI
    10.1109/SISPAD.2006.282914
  • Filename
    4061657