DocumentCode
3234486
Title
Monte Carlo Simulation of Boron Implantation into (100) Germanium
Author
Wittmann, R. ; Hossinger, A. ; Cervenka, J. ; Uppal, S. ; Selberherr, S.
Author_Institution
Inst. for Microelectron., TU Wien
fYear
2006
fDate
6-8 Sept. 2006
Firstpage
381
Lastpage
384
Abstract
We present a Monte Carlo simulation study for introducing boron ions into Ge in the energy range from 5 to 40 keV. The successful calibration of our ion implantation simulator for crystalline Ge is demonstrated by comparing the predicted boron profiles with SIMS measurements. The generation of point defects are calculated with a modified Kinchin-Pease damage model. An implanted boron profile in Ge is shallower than in Si for any given energy due to the larger nuclear and electronic stopping power of Ge atoms. We found that the higher displacement energy in Ge, the stronger backscattering effect, and the smaller energy transfer from the ion to the primary recoil of a collision cascade are mainly responsible for the significantly reduced damage in Ge
Keywords
Monte Carlo methods; backscatter; boron; calibration; elemental semiconductors; energy loss of particles; germanium; ion implantation; point defects; semiconductor device manufacture; 5 to 40 keV; Ge:B; Kinchin-Pease damage model; Monte Carlo simulation; backscattering effect; boron implantation; calibration; collision cascade; electronic stopping power; germanium; ion implantation simulator; point defect; Atomic measurements; Backscatter; Boron; Calibration; Crystallization; Germanium; Ion implantation; Nuclear electronics; Nuclear power generation; Predictive models;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2006 International Conference on
Conference_Location
Monterey, CA
Print_ISBN
1-4244-0404-5
Type
conf
DOI
10.1109/SISPAD.2006.282914
Filename
4061657
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