• DocumentCode
    3235171
  • Title

    Improvement of power consumption and lifetime characteristics of SDA rotary micromotor

  • Author

    Huang, I-Yu ; Lee, Yen-Chi ; Chen, Guan-Ming ; Horng, Alex

  • Author_Institution
    Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung
  • fYear
    2008
  • fDate
    6-9 Jan. 2008
  • Firstpage
    738
  • Lastpage
    741
  • Abstract
    This paper presents a new design and fabrication of scratch drive actuator (SDA) micro rotary motor with low driving voltage and high lifetime characteristics. To substantially reduce the driving-voltage from 30~150 Vo-p to 12~30 Vo-p, a silicon wafer with ultra low-resistivity (0.001 Omega-cm) was firstly adopted as the substrate of SDA micromotor. Furthermore, a novel "ribbed ring and the filleted beam" structure design for the improvement of lifetime (>72 hrs) of SDA micromotor was also demonstrated in this research. Many different geometric designs of the SDA-plate, including the rectangle and triangle SDA-plates with or without etching holes, are investigated for characteristics optimization of SDA micromotor. A MUMPs-like polysilicon- based surface micromachining technology is developed for the implementation of the SDA micromotor.
  • Keywords
    micromachining; micromotors; filleted beam structure; lifetime characteristic; polysilicon based surface micromachining technology; power consumption; ribbed ring; rotary micromotor; scratch drive actuator micro rotary motor; silicon wafer; ultralow resistivity; Actuators; Design optimization; Energy consumption; Etching; Geometry; Insulators; Micromachining; Micromotors; Silicon; Voltage; MUMPs; Micromotor; Scratch drive actuator (SDA); Surface micromachining technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1907-4
  • Electronic_ISBN
    978-1-4244-1908-1
  • Type

    conf

  • DOI
    10.1109/NEMS.2008.4484434
  • Filename
    4484434