• DocumentCode
    3235290
  • Title

    Optimum design considerations for a 3-DOF micro accelerometer using nanoscale piezoresistors

  • Author

    Tran, Tan D. ; Dao, Dzung V. ; Bui, Tung T. ; Nguyen, Long T. ; Nguyen, Thuy P. ; Susumu, S.

  • Author_Institution
    Coll. of Technol., Dept. of MEMS & Microsyst., Vietnam Nat. Univ. of Hanoi, Hanoi
  • fYear
    2008
  • fDate
    6-9 Jan. 2008
  • Firstpage
    770
  • Lastpage
    773
  • Abstract
    This paper presents the design optimization of high performance three-degree of freedom silicon accelerometer. The purpose of this optimization is to achieve the high sensitivity and high resolution. The optimization has been performed based on considerations of junction depth, the doping concentration of the piezoresistor, the temperature coefficient sensitivity, the noise, and the power consumption. Taking advantage of high piezoresistive effect in nanoscale piezoresistor, the cross-sectional area of the piezoresistor is fabricated to be 15x104 nm2. The result shows that the sensitivity of the optimized accelerometer is improved while the resolution is comparable to previous results. The dimension of sensor is as small as 1 mm2, so it is suitable for many immerging applications.
  • Keywords
    accelerometers; microsensors; nanotechnology; piezoresistive devices; 3-DOF micro accelerometer; design optimization; doping concentration; junction depth; nanoscale piezoresistors; piezoresistive effect; power consumption; silicon accelerometer; temperature coefficient sensitivity; Accelerometers; Decision support systems; Piezoresistive devices; Quadratic programming; Systems engineering and theory; Virtual reality; accelerometter; nanoscale piezoresistor; optimization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1907-4
  • Electronic_ISBN
    978-1-4244-1908-1
  • Type

    conf

  • DOI
    10.1109/NEMS.2008.4484440
  • Filename
    4484440