DocumentCode
3235319
Title
Microfluidic chip fabrication by micro-powder blasting
Author
Shih, Yung-Hsun ; Shen, Yung-Kang ; Lin, Yi ; Ou, Keng-Liang ; Hong, Rong-Hong ; Hsu, Sung-Chih
Author_Institution
Sch. of Dentistry, Taipei Med. Univ., Taipei
fYear
2008
fDate
6-9 Jan. 2008
Firstpage
780
Lastpage
783
Abstract
Micro-powder blasting uses the high speed gas flow which mixed the micro-particle and gas to impact the brittle substrate by the specialized nozzle. This research combined various diameters Al2O3 eroding particle with a novel masking technique to fabricate the pattern channels in soda glass with a width down to 50 mum and depth down to 90 mum. The masking technology is consisted by the combination of two polymers: (1) the brittle epoxy resin SU-8 for its photosensitivity and (2) the elastic and thermal-curable poly-(dimethyl siloxane) (PDMS) for its erosion resistance. This research uses the different processing parameters (gas pressure, nozzle/substrate distance, particle size, impact angle, and erosion time) to find the optimal process by single-parameter method. The results show that the micro-channel becomes deeper as the gas pressure increases. The micro-channel decreases the depth as the nozzle/substrate distance increases. The surface roughness of micro-channel of microfluidic chip is about 5-6 mum.
Keywords
aluminium compounds; erosion; high-speed techniques; masks; microchannel flow; nozzles; polymers; powder technology; sandblasting; surface roughness; Al2O3; brittle substrate; epoxy resin SU-8; erosion resistance; erosion time; gas pressure; high speed gas flow; impact angle; masking technique; microchannel; microfluidic chip fabrication; microparticle; micropowder blasting; nozzle-substrate distance; particle size; pattern channels; photosensitivity; poly(dimethyl siloxane); single-parameter method; soda glass; surface roughness; Aluminum oxide; Chip scale packaging; Glass; Machining; Microchannel; Microfluidics; Powders; Resists; Rough surfaces; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location
Sanya
Print_ISBN
978-1-4244-1907-4
Electronic_ISBN
978-1-4244-1908-1
Type
conf
DOI
10.1109/NEMS.2008.4484442
Filename
4484442
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