• DocumentCode
    3235422
  • Title

    Sub-100 nm-scale aluminum nanowires by stencil lithography: Fabrication and characterization

  • Author

    Vazquez-Mena, O. ; Savu, V. ; Sidler, K. ; Villanueva, G. ; van den Boogaart, M.A.F. ; Brugger, J.

  • Author_Institution
    Microsyst. Lab., Ecole Polytech. Fed. de Lausanne, Lausanne
  • fYear
    2008
  • fDate
    6-9 Jan. 2008
  • Firstpage
    807
  • Lastpage
    811
  • Abstract
    We present the fabrication process and electrical characterization of sub-100 nm scale Al nanowires (NWs) fabricated by stencil lithography (SL). We use a stencil with sub- 100 nm wide nanoslits patterned by focused ion beam (FIB) milling. The stencil is aligned and clamped onto a substrate containing predefined electrical contacts. Then a 60 nm-thick layer of Aluminum (Al) is deposited through the stencil producing NWs with lengths of ~1, 2 and 5 mum and widths down to 65 nm. The NWs show an ohmic behavior with values varying from 30 Omega up to 300 Omega, depending on the dimensions of the structures. We have extracted a resistivity for the Al NWs of ~10 x 10-8 Omegam. We also show that stencils can be cleaned and reused, proving that SL is a cost-efficient and scalable manufacturing method for the direct fabrication of metallic NWs on a full wafer scale.
  • Keywords
    aluminium; ion beam lithography; nanocontacts; nanolithography; nanowires; Al; aluminum nanowires fabrication; electrical characterization; electrical contacts; focused ion beam milling; ohmic behavior; size 100 nm; size 60 nm; stencil lithography; Aluminum; Conductivity; Contacts; Fabrication; Ion beams; Lithography; Manufacturing; Milling; Nanowires; Stereolithography; nanowires; stencil lithography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1907-4
  • Electronic_ISBN
    978-1-4244-1908-1
  • Type

    conf

  • DOI
    10.1109/NEMS.2008.4484447
  • Filename
    4484447