Development of multi-layer for Au nanorod assembly

Author

Leem, Myoung-Kun ; Kim, Chang-Man ; Kim, Kyu-Jin ; Kang, Won-Seok ; Kim, Jae-Ho ; Lee, Jung-Hee ; Kwon, Dae-Hyuk ; Kang, Shin-Won

Author_Institution

Dept. of Electron. Eng., Kyungpook Nat. Univ., Daegu

fYear

2008

fDate

6-9 Jan. 2008

Firstpage

838

Lastpage

841

Abstract

In this study, dielectrophoresis (DEP) principle was used to assemble Au nanorods which were synthesized by electrochemical deposition (ECD) method. The nanorod assembly electrode was designed by considering the simulation and fabricated using semiconductor fabrications. In experiment, only 1st layer and multilayer were experienced to compare the Au nanorod assembly efficiency. First, assembly efficiency was about 20 % when 20 kHz, 20 Vp-p (AC) was applied on the only 1st layer. Second, multi-layer was designed for getting high assembly efficiency. Assembly efficiency was improved by 45 % when 10 V (DC) was applied on the 1st layer electrode and 20 kHz, 20 Vp-p (AC) was applied on the 2nd layer electrode. As a result, the Au nanorod assembly efficiency of the multi-layer was increased about 25 % than assembly efficiency of the only 1st layer.

Keywords

electrodeposition; electrophoresis; nanostructured materials; Au nanorod assembly; dielectrophoresis principle; electrochemical deposition method; multilayer development; nanorod assembly electrode; semiconductor fabrication; Assembly systems; Dielectric constant; Dielectrophoresis; Electrodes; Fabrication; Frequency; Gold; IEEE members; Nanobioscience; Voltage; ECD; dielectrophoresis (DEP); nanorod assembly;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on

Conference_Location

Sanya

Print_ISBN

978-1-4244-1907-4

Electronic_ISBN

978-1-4244-1908-1

Type

conf

DOI

10.1109/NEMS.2008.4484454

Filename

4484454