DocumentCode :
3235655
Title :
Comparison of conventional and collapse-mode CMUT in 1-D array configuration
Author :
Park, K.K. ; Oralkan, O. ; Khuri-Yakub, B.T.
Author_Institution :
Center for Nanoscale Sci. & Eng., Stanford Univ., Stanford, CA, USA
fYear :
2011
fDate :
18-21 Oct. 2011
Firstpage :
1000
Lastpage :
1003
Abstract :
This paper presents a comparison between two types of capacitive micromachined transducers (CMUTs), one operating in the conventional mode and the other one in the collapse-mode. Both types of devices are designed to have the same membrane properties (silicon, 1-μm thick), the same peak frequency (10 MHz) and similar operating bias voltages (100 V - 130 V). In the finite element analysis (FEA) of transmit pressure, both types of devices have similar fractional bandwidth (FBW) more than 120%, whereas, the collapse-mode CMUT has higher output pressure (46.5 kPa/V) than that of the conventional CMUT (13.1 kPa/V). To validate the FEA results, these two devices are fabricated using LOCOS/wafer-bonding process. The fabricated devices have a phased array configuration with an element pitch of 75 μm. The output pressure and the FBW of the conventional CMUT is 110% and 12.7 kPa/V, respectively, which match well with FEA results. The collapse-mode CMUT has a FBW of 102.5% and output pressure of 26.4 kPa/V. With a large AC excitation and high DC bias, the conventional CMUT has an output pressure of 1.25 MPap-p with 56.4-Vp-p AC and 180-V DC. The collapse-mode CMUT has an output pressure of 2.37 MPap-p with 56.2-Vp-p AC, and 150-V DC.
Keywords :
capacitive sensors; finite element analysis; ultrasonic transducer arrays; 1D array configuration; FEA; LOCOS/wafer-bonding process; capacitive micromachined transducers; collapse-mode CMUT; finite element analysis; fractional bandwidth; frequency 10 MHz; size 1 mum; size 75 mum; voltage 100 V to 130 V; Acoustics; Arrays; Finite element methods; Frequency measurement; Pressure measurement; Transducers; Voltage measurement; CMUT; Collapse-mode; LOCOS; MEMS;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2011 IEEE International
Conference_Location :
Orlando, FL
ISSN :
1948-5719
Print_ISBN :
978-1-4577-1253-1
Type :
conf
DOI :
10.1109/ULTSYM.2011.0245
Filename :
6293697
Link To Document :
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