• DocumentCode
    3235686
  • Title

    Continuous dielectrophoretic separation in the iterative curves using dc-biased ac electric fields

  • Author

    Zhang, Lujun ; Bastemeijer, Jeroen ; Mollinger, Jeff ; Bossche, Andre

  • Author_Institution
    Electron. Instrum. Lab., Delft Univ. of Technol., Delft
  • fYear
    2008
  • fDate
    6-9 Jan. 2008
  • Firstpage
    864
  • Lastpage
    868
  • Abstract
    This paper presents a novel high resolution micro-separator which is capable of separating submicron particles with low voltages. The curved part of serpentine micro-channel that causes performance deterioration in capillary electrophoresis (CE) due to the plug dispersion will be effectively used in our design for dielectrophoretic (DEP) separation. The results of theoretical analysis and finite element modeling and simulation show a great potential of the design. The device is fabricated by bonding a glass wafer and a silicon wafer with electrodes on the surface together with an SU-8 layer in between. The preliminary experimental result gives the proof of basic dielectrophoretic effect in the curve.
  • Keywords
    electric fields; electrophoresis; finite element analysis; flow separation; microchannel flow; wafer bonding; DC-biased AC electric fields; capillary electrophoresis; continuous dielectrophoretic separation; finite element modeling; glass wafer bonding; iterative curves; microseparator resolution; plug dispersion; serpentine microchannel; submicron particles; Analytical models; Dielectrophoresis; Dispersion; Electric fields; Electrokinetics; Finite element methods; Low voltage; Plugs; Semiconductor device modeling; Wafer bonding; Curves; Dielectrophoresis; Microfluidics; Separation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1907-4
  • Electronic_ISBN
    978-1-4244-1908-1
  • Type

    conf

  • DOI
    10.1109/NEMS.2008.4484460
  • Filename
    4484460