DocumentCode :
3235890
Title :
Replication of polymeric micro patterns by rapid thermal pressing with induction heating apparatus
Author :
Hong, Seok-Kwan ; Heo, Young-Moo ; Kang, JeongJin
Author_Institution :
Korea Inst. of Ind. Technol., Incheon
fYear :
2008
fDate :
6-9 Jan. 2008
Firstpage :
911
Lastpage :
915
Abstract :
Hot embossing, one of nanoimprint lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a micro patterning mold at high speed with the uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from 25degC to 150degC within 1.8 seconds with the temperature variation of plusmn10degC in 4-inch diameter area, using the induction heating apparatus. Micro patterns of 120 mum line width and 25 mum height were successfully replicated on a plastic sheet under the pressure of about 0.09 MPa within 60 seconds.
Keywords :
embossing; induction heating; nanolithography; rapid thermal processing; hot embossing; induction heating apparatus; micro patterning mold; nanoimprint lithography; polymeric micro patterns; rapid thermal pressing; Cooling; Costs; Embossing; Heating; Lithography; Manufacturing processes; Nickel; Polymers; Pressing; Temperature distribution; hot embossing; induction heating; nanoimprint lithography; rapid heating;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location :
Sanya
Print_ISBN :
978-1-4244-1907-4
Electronic_ISBN :
978-1-4244-1908-1
Type :
conf
DOI :
10.1109/NEMS.2008.4484471
Filename :
4484471
Link To Document :
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