• DocumentCode
    3236277
  • Title

    Development of transdermal delivery chip system: Deliver gold nanoparticles into human stratum corneume

  • Author

    Chen, Hung-Yi ; Zhao, Qiaole ; Su, Kuei-Ling ; Lin, Yu-Cheng

  • Author_Institution
    Dept. of Eng. Sci., Nat. Cheng Kung Univ., Tainan
  • fYear
    2008
  • fDate
    6-9 Jan. 2008
  • Firstpage
    996
  • Lastpage
    999
  • Abstract
    This paper reports a transdermal delivery chip system for delivering gold nanoparticles (AuNPs) into human stratum corneum (HSC). The proposed transdermal delivery chip system could provide electrostatic force to drive AuNPs which were then delivered into HSC via intercellular route. Various DC voltages (3, 6, and 9 V) were employed to generate electric field of different intensities (3.2~9.8 V/cm) as a role to drive AuNPs into HSC. Results show permeability of the skin increases with the electric field intensities. We use MEMS technology to design and fabricate the proposed chip system. The proposed transdermal delivery chip system will provide many potential usages for biomedical applications.
  • Keywords
    bioMEMS; biomedical electronics; drug delivery systems; gold; nanoparticles; nanotechnology; permeability; skin; Au; DC voltages; MEMS technology; biomedical applications; drug delivery system; electric field intensity; electrostatic force; gold nanoparticles; human stratum corneum; skin permeability; transdermal delivery chip system; voltage 3 V; voltage 6 V; voltage 9 V; Electrodes; Electrostatics; Gold; Humans; Laboratories; Micromechanical devices; Nanoparticles; Skin; Systems engineering and theory; Voltage; Chip system; Gold nanoparticles; Human stratum corneum; Transdermal;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1907-4
  • Electronic_ISBN
    978-1-4244-1908-1
  • Type

    conf

  • DOI
    10.1109/NEMS.2008.4484489
  • Filename
    4484489