• DocumentCode
    3236455
  • Title

    Using metal-insulator-semiconductor capacitor to investigate the charge accumulation in capacitive RF MEMS switches

  • Author

    San, Haisheng ; Chen, Xuyuan ; Xu, Peng ; Li, Gang ; Zhan, Linxian

  • Author_Institution
    Pen-Tung Sah Micro-Electro-Mech. Syst. Res. Center, Xiamen Univ., Xiamen
  • fYear
    2008
  • fDate
    6-9 Jan. 2008
  • Firstpage
    1048
  • Lastpage
    1052
  • Abstract
    A metal-insulator-semiconductor (MIS) capacitor is used to simulate the metal-insulator-metal (MIM) structure of capacitive RF MEMS switches. By measuring the C-V characteristics for the MIS structure, the dielectric charging in capacitive RF MEMS switches can be analyzed. An analytical model has been established to describe the feasibility of this method. In the experiment, the effect of the constant voltage stress on the charge accumulation in the dielectric layer of MIS capacitor was investigated. The experimental results show that three main physical processes dominate the dielectric charging behavior. The advantages of using this method are that the reliability test of the switches and the evaluation of the candidate dielectric materials can be carried out by using MIS capacitor, the experimental cost, therefore, can be sharply reduced.
  • Keywords
    MIM structures; MIS capacitors; dielectric materials; finite element analysis; microswitches; MIM structure; MIS capacitor; capacitive RF MEMS switches; dielectric charging behavior; dielectric materials; metal-insulator-metal structure; metal-insulator-semiconductor capacitor; switches reliability test; Analytical models; Capacitance-voltage characteristics; Dielectric measurements; MIM capacitors; Materials reliability; Metal-insulator structures; Radiofrequency microelectromechanical systems; Stress; Switches; Voltage; C-V characteristics; MIS capacitor; capacitive RF MEMS switch; charge accumulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1907-4
  • Electronic_ISBN
    978-1-4244-1908-1
  • Type

    conf

  • DOI
    10.1109/NEMS.2008.4484499
  • Filename
    4484499