Title :
New composite shape memory functional material for nano and microengineering application
Author :
Khovaylo, Vladimir ; Kirilin, Alexander ; Koledov, Victor ; Lebedev, Gor ; Pushin, Vladimir ; Shavrov, Vladimir ; Tulaykova, Alexandra
Author_Institution :
Inst. of Radioengineering & Electron. of RAS, Moscow
Abstract :
The aim of the present work is to propose the new composite functional material on the basis of shape memory effect (SME) alloy which permits the much higher reversible change of the bending strain. This change can be attained under the action of thermal field in case of SME alloys or SME polymers and moreover under the action of magnetic field in case of ferromagnetic shape memory alloys. The composite includes a SME element in the form of ribbon, film or plate and an elastic layer of usual metal. Elements are connected rigidly to each other. The pseudo plastic tensile deformation is given to the SME layer before connecting to the elastic element. The result is the reversible giant bending strain (up to 10 %) of composite, though only the "one-way" shape memory effect of the SME element is used. We discuss the new composite system as promising elements for NEMS. On the bases of proposed functional material several solutions for example, micro- and possibly nanomanipulators, micro valves, pumps, tweezers, "spider lap" actuators end so on should be constructed.
Keywords :
composite materials; micromechanical devices; nanotechnology; shape memory effects; composite functional material; composite shape memory functional material; ferromagnetic shape memory alloys; magnetic field; microengineering application; nanoengineering application; pseudo plastic tensile deformation; reversible giant bending strain; shape memory effect alloy; thermal field; Capacitive sensors; Composite materials; Iron alloys; Joining processes; Magnetic field induced strain; Magnetic films; Magnetic materials; Plastics; Polymers; Shape memory alloys;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location :
Sanya
Print_ISBN :
978-1-4244-1907-4
Electronic_ISBN :
978-1-4244-1908-1
DOI :
10.1109/NEMS.2008.4484536