• DocumentCode
    3237342
  • Title

    Silicon photonics: The inside story

  • Author

    Jalali, Bahram

  • Author_Institution
    Dept. of Electr. Eng., Univ. of California, Los Angeles, Los Angeles, CA
  • fYear
    2008
  • fDate
    13-15 Oct. 2008
  • Firstpage
    157
  • Lastpage
    166
  • Abstract
    The electronic chip industry embodies the height of technological sophistication and economics of scale. Fabricating inexpensive photonic components by leveraging this mighty manufacturing infrastructure has fueled intense interest in silicon photonics. If it can be done economically and in an energy efficient manner, empowering silicon with optical functionality will bring optical communications to the realm of computers where limitations of metallic interconnects are threatening the industrypsilas future. The field is making stunning progress and stands to have a bright future, as long as the community recognizes the real challenges, and maintains an open mind with respect to its applications. This talk will review recent dasiagame changingpsila developments and discuss promising applications beyond data communication. It will conclude with recent observation of extreme-value statistical behavior in silicon photonics, a powerful example of how scientific discoveries can unexpectedly emerge in the course of technology development.
  • Keywords
    integrated optics; silicon; Si; electronic chip industry; extreme-value statistical behavior; metallic interconnects; optical communications; photonic components; silicon photonics; Electronics industry; Energy efficiency; Fuel economy; Industrial economics; Industrial electronics; Manufacturing industries; Optical interconnections; Photonics; Power generation economics; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bipolar/BiCMOS Circuits and Technology Meeting, 2008. BCTM 2008. IEEE
  • Conference_Location
    Monteray, CA
  • ISSN
    1088-9299
  • Print_ISBN
    978-1-4244-2725-3
  • Electronic_ISBN
    1088-9299
  • Type

    conf

  • DOI
    10.1109/BIPOL.2008.4662735
  • Filename
    4662735