• DocumentCode
    3237405
  • Title

    60 GHz ultra low phase noise sige common base oscillator using a wirebond coupled mcm integrated micromachined cavity resonator

  • Author

    Ocket, I. ; Mills, J.B. ; John, A. ; Nauwelaers, B.

  • Author_Institution
    ESAT/Telemic, Katholieke Univ. Leuven, Heverlee
  • fYear
    2008
  • fDate
    13-15 Oct. 2008
  • Firstpage
    182
  • Lastpage
    185
  • Abstract
    This paper reports on a 60 GHz common base fundamental oscillator with ultra low phase noise realized in QUBIC4Xpsilas HBT technology. It uses a silicon micromachined cavity resonator which is mounted on a common MCM PASSI3I carrier and coupled to the MMIC. A novel feed approach is presented which uses a wirebond to couple the interconnecting CPW line to the KOH-etched silicon cavity of which the advantages are ease of manufacture and reduced substrate effects compared to other coupling approaches. Oscillator measurement results for the stand-alone MMIC are presented and compared to 2.5D/3D simulations. The important effect of wirebond shape variability is quantified in terms of oscillation frequency, output power and phase noise.
  • Keywords
    Ge-Si alloys; heterojunction bipolar transistors; microcavities; oscillators; phase noise; KOH-etched silicon cavity; QUBIC4X HBT technology; SiGe; frequency 60 GHz; oscillation frequency; oscillator measurement; output power; planar passive multichip module; stand-alone MMIC; ultra low phase noise common base oscillator; wirebond coupled MCM integrated micromachined cavity resonator; wirebond shape variability; Cavity resonators; Coplanar waveguides; Feeds; Germanium silicon alloys; Heterojunction bipolar transistors; MMICs; Manufacturing; Oscillators; Phase noise; Silicon germanium; BiCMOS integrated circuits; cavity resonators; coplanar waveguide; micromachining; millimeter wave oscillators; monolithic microwave integrated circuit; multichip modules;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bipolar/BiCMOS Circuits and Technology Meeting, 2008. BCTM 2008. IEEE
  • Conference_Location
    Monteray, CA
  • ISSN
    1088-9299
  • Print_ISBN
    978-1-4244-2725-3
  • Electronic_ISBN
    1088-9299
  • Type

    conf

  • DOI
    10.1109/BIPOL.2008.4662739
  • Filename
    4662739