• DocumentCode
    3239146
  • Title

    Electron spin resonance characterization of Unibond(R) material

  • Author

    Conley, J.F., Jr. ; Lenhan, P.M. ; Wallace, B.D.

  • Author_Institution
    Commercial Syst., Dynamics Res. Corp., Beaverton, OR, USA
  • fYear
    1996
  • fDate
    30 Sep-3 Oct 1996
  • Firstpage
    164
  • Lastpage
    165
  • Abstract
    Although recent studies of the electrical properties of Unibond(R) films have reported promising electrical characteristics, the physical nature of the defect structures responsible for the charge trapping properties of these films have not yet been studied via electron spin resonance (ESR). ESR provides structural information and allows testing of minimally processed structures making it an ideal tool for studying charge trapping in SiO2 films. When combined with electrical measurements such as capacitance vs. voltage (CV), ESR studies can provide detailed information about the atomic scale defect structures that dominate the electronic properties of thin insulating films. An atomic scale understanding of the electronic properties can be an important guide for future development. In this abstract, we compare the ESR and CV response of Unibond(R) wafers to hole injection and VUV irradiation
  • Keywords
    paramagnetic resonance; silicon-on-insulator; wafer bonding; SOI; Si-SiO2; Unibond wafer; VUV irradiation; capacitance voltage characteristics; charge trapping; defect structure; electron spin resonance; electronic properties; hole injection; insulating film; Annealing; Atomic measurements; Charge measurement; Current measurement; Density measurement; Electron traps; Implants; Paramagnetic resonance; Temperature; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1996. Proceedings., 1996 IEEE International
  • Conference_Location
    Sanibel Island, FL
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-3315-2
  • Type

    conf

  • DOI
    10.1109/SOI.1996.552545
  • Filename
    552545