Title :
Locating Signal Line Defects with Thermal Image Analysis
Author :
Thompson, M. ; Brusso, P.
Author_Institution :
IBM Corporation, STD-Endicott, NY
Keywords :
Circuit faults; Electric resistance; Electrical fault detection; Image analysis; Paper technology; Printed circuits; Professional communication; Sections; Thermal conductivity; Thermal engineering;
Conference_Titel :
Southern Tier Technical Conference, 1987. Proceedings of the 1987 IEEE
DOI :
10.1109/STIER.1987.716391
