DocumentCode
3239258
Title
Locating Signal Line Defects with Thermal Image Analysis
Author
Thompson, M. ; Brusso, P.
Author_Institution
IBM Corporation, STD-Endicott, NY
fYear
1987
fDate
31896
Firstpage
173
Lastpage
183
Keywords
Circuit faults; Electric resistance; Electrical fault detection; Image analysis; Paper technology; Printed circuits; Professional communication; Sections; Thermal conductivity; Thermal engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
Southern Tier Technical Conference, 1987. Proceedings of the 1987 IEEE
Type
conf
DOI
10.1109/STIER.1987.716391
Filename
716391
Link To Document