Wave soldering using a no-clean process

The accelerated interest in adopting a no-clean soldering process is due not only to the rapid phase out of CFC cleaning but also because it can be a very cost effective process. However, the use of no-clean fluxes, typically with 2% solids, presents some special challenges to the soldering equipment, process control and even to the product being soldered. This paper examines these challenges in detail and discusses possible solutions. Some of the items discussed include flux application and control, preheating techniques, solder wave dynamics and the benefits of inerting the process