Creepage breakdown characteristics of printed wiring board in silicone gel

Author

Maeda, T. ; Haga, K. ; Maeda, T.

Author_Institution

Fuji Electr. Corp. Res. & Dev. Ltd., Yokosuka, Japan

Volume

2

fYear

1996

fDate

20-23 Oct 1996

Firstpage

734

Abstract

We measured the creepage breakdown characteristics of printed wiring boards in silicone gel in three types of specimens, one each with and without a background electrode, and one with a background electrode but without a surface earth electrode. The relationship between creepage breakdown voltage and creepage distance was obtained for the specimens with a surface earth electrode and with and without a background electrode. The breakdown voltage of the specimen without a surface earth electrode was separated into substrate surface perimeter and substrate side components

Keywords

electric breakdown; epoxy insulation; insulation testing; power electronics; printed circuit testing; silicones; background electrode; breakdown voltage; creepage breakdown characteristics; creepage distance; power devices; printed wiring board; silicone gel; substrate side component; substrate surface perimeter component; surface earth electrode; Breakdown voltage; Copper; Earth; Electric breakdown; Electrodes; Epoxy resins; Insulated gate bipolar transistors; Insulation; Thyristors; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation and Dielectric Phenomena, 1996., IEEE 1996 Annual Report of the Conference on

Conference_Location

Millbrae, CA

Print_ISBN

0-7803-3580-5

Type

conf

DOI

10.1109/CEIDP.1996.564592

Filename

564592