DocumentCode
3240831
Title
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)
Volume
2
fYear
2004
fDate
1-4 June 2004
Abstract
The following topics are dealt with: thermal management; thermal interface materials; experimental methods and procedures; natural convection and passive thermal management of electronics; thermal and packaging optimization in telecommunications; forced convection cooling; refrigerated systems; thermal design and sustainability; airborne and space system; heat sinks; micro and meso scale thermal management; fundamentals and applications of conduction; thermal simulation and modeling; system level thermal design of electronic equipment; data center thermal management; package characterization and modeling; novel cooling methods for microelectronics; software tools and techniques; thermal management of microelectronic systems; heat pipes and thermosyphons; high flux liquid cooling techniques; mechanics of materials; lead free solder materials and reliability; constitutive modeling and viscoplasticity; failure mechanics and damage modeling; package level reliability; modeling and simulation; nanoscale phenomena in microelectronics; green packaging; optoelectronics; MEMS modeling and packaging; nanoscale thermal effects in electronics; MEMS thermal management.
Keywords
cooling; electronics packaging; forced convection; heat conduction; heat pipes; heat sinks; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; life testing; micromechanical devices; natural convection; printed circuit design; refrigeration; soldering; thermal conductivity; thermal management (packaging); thermoelectric devices; thermoelectricity; thermomechanical treatment; MEMS; airborne system; constitutive modeling; data center thermal management; electronic equipment; electronics packaging optimization; failure mechanics; forced convection cooling; green packaging; heat conduction; heat pipes; heat sinks; heat transfer; high flux liquid cooling techniques; lead free solder materials; life testing; mesoscale thermal management; microelectronics; microscale thermal management; nanoscale phenomena; nanoscale thermal effects; natural convection; optoelectronics; passive thermal management; printed circuit design; refrigerated systems; reliability; software tools; space system; system level thermal design; telecommunication optimization; thermal design; thermal interface materials; thermal modeling; thermal simulation; thermomechanical effects; thermosyphons; viscoplasticity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Conference_Location
Las Vegas, NV, USA
Print_ISBN
0-7803-8357-5
Type
conf
DOI
10.1109/ITHERM.2004.1318202
Filename
1318202
Link To Document