Title :
IC package modeling and characterization for RF applications
Author :
Yang, Zemo ; Moore, Dearl ; Ewanich, Jon
Abstract :
A novel method to study the parasitic effect of IC packages in RF applications is introduced in this paper. As an application of the method, a case study of PQFP32 (7×7×1.4 mm body) package modeling, the coupling noise and effective ground inductance is investigated. Package design optimization upon the RF performance as well as thermal performance are also discussed
Keywords :
Application specific integrated circuits; Electronic packaging thermal management; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit noise; Integrated circuit packaging; Radio frequency; Radiofrequency integrated circuits; Semiconductor device noise; Transmission line measurements;
Conference_Titel :
WESCON/'95. Conference record. 'Microelectronics Communications Technology Producing Quality Products Mobile and Portable Power Emerging Technologies'
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-2636-9
DOI :
10.1109/WESCON.1995.485260
