DocumentCode
3241081
Title
IC package modeling and characterization for RF applications
Author
Yang, Zemo ; Moore, Dearl ; Ewanich, Jon
fYear
1995
fDate
7-9 Nov. 1995
Firstpage
106
Abstract
A novel method to study the parasitic effect of IC packages in RF applications is introduced in this paper. As an application of the method, a case study of PQFP32 (7×7×1.4 mm body) package modeling, the coupling noise and effective ground inductance is investigated. Package design optimization upon the RF performance as well as thermal performance are also discussed
Keywords
Application specific integrated circuits; Electronic packaging thermal management; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit noise; Integrated circuit packaging; Radio frequency; Radiofrequency integrated circuits; Semiconductor device noise; Transmission line measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
WESCON/'95. Conference record. 'Microelectronics Communications Technology Producing Quality Products Mobile and Portable Power Emerging Technologies'
Conference_Location
San Francisco, CA, USA
ISSN
1095-791X
Print_ISBN
0-7803-2636-9
Type
conf
DOI
10.1109/WESCON.1995.485260
Filename
485260
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