DocumentCode
3241981
Title
1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395)
fYear
1999
fDate
9-11 May 1999
Abstract
The following topics were dealt with: plasma equipment; pattern dependent charging effects; electron shading; device characterization; thin gate oxides; frequency/time modulation effects; process integration; and charging mechanisms
Keywords
insulating thin films; integrated circuit reliability; integrated circuit technology; plasma materials processing; charging mechanisms; device characterization; electron shading; frequency modulation effects; pattern dependent charging effects; plasma equipment; process integration; thin gate oxides; time modulation effects;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Process-Induced Damage, 1999 4th International Symposium on
Conference_Location
Monterey, CA, USA
Print_ISBN
0-9651577-3-3
Type
conf
DOI
10.1109/PPID.1999.798793
Filename
798793
Link To Document