Title :
1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395)
Abstract :
The following topics were dealt with: plasma equipment; pattern dependent charging effects; electron shading; device characterization; thin gate oxides; frequency/time modulation effects; process integration; and charging mechanisms
Keywords :
insulating thin films; integrated circuit reliability; integrated circuit technology; plasma materials processing; charging mechanisms; device characterization; electron shading; frequency modulation effects; pattern dependent charging effects; plasma equipment; process integration; thin gate oxides; time modulation effects;
Conference_Titel :
Plasma Process-Induced Damage, 1999 4th International Symposium on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-9651577-3-3
DOI :
10.1109/PPID.1999.798793
