• DocumentCode
    3242002
  • Title

    Nano-vibration characteristics of a piezoelectric plate wirelessly driven by electric field

  • Author

    Bhuyan, Satnarayan ; Hu, Junhui

  • Author_Institution
    Div. of Microelectron., Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2009
  • fDate
    14-17 July 2009
  • Firstpage
    1005
  • Lastpage
    1009
  • Abstract
    Nano-vibration characteristics of a wirelessly driven piezoelectric plate operating in the thickness mode have been analyzed in this work. A mechanical resonance vibration is excited in the piezoelectric plate wirelessly driven by ac electric field produced from focused electric field structure. Theoretically it has been found that the vibration displacement depends on the electric field, operating frequency, electrical load, and dimensions of the driven piezoelectric plate. The electric field pattern is theoretically calculated to assess the electric field on the surface of the piezoelectric plate. It has been observed that the vibration displacement reaches the maximum at resonance frequency, and the maximum vibration displacement is in the nanometer range. It has been seen that the vibration displacement at resonance increases with the increase of the electrical load resistance, the increase of the area of piezoelectric plate, and the decrease of the thickness of piezoelectric plate operating in the thickness vibration mode.
  • Keywords
    nanomechanics; piezoelectric devices; plates (structures); resonance; vibrations; electric field; electric field pattern; electrical load resistance; mechanical resonance vibration; nanovibration characteristics; piezoelectric devices; resonance frequency; vibration displacement; wirelessly driven piezoelectric plate; Electric fields; Electric resistance; Resonance; Resonant frequency; Surface resistance; Vibrations; Mechanical resonance vibration; piezoelectric plate; wireless drive;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Intelligent Mechatronics, 2009. AIM 2009. IEEE/ASME International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2852-6
  • Type

    conf

  • DOI
    10.1109/AIM.2009.5229718
  • Filename
    5229718