DocumentCode
3242079
Title
A Novel Release Policy for Hybrid Make-to-Stock/Make-to-Order Semiconductor Manufacturing Systems
Author
Rezaie, K. ; Eivazy, H. ; Nazari-Shirkouhi, S.
Author_Institution
Ind. Eng. Dept., Univ. of Tehran, Tehran, Iran
fYear
2009
fDate
14-16 Dec. 2009
Firstpage
443
Lastpage
447
Abstract
Production planning of semiconductor manufacturing systems is one of the most complex issues in the literature. This complexity stems from the natural characteristics of these systems such as: producing make-to-stock (MTS) and make-to-order (MTO) products concurrently (hybrid MTS/MTO manufacturing environment), dynamic MTO products arrival, and re-entrancy feature. One of the challenging parts of production planning is the release mechanism of products into the shop. Therefore, in this paper we present a novel release policy for a semiconductor shop (fab) with hybrid MTS/MTO production environment. To evaluate the proposed release policy, several performance measures for MTS and MTO products are considered. Moreover, a number of numerical experiments have been conducted by simulation studies. Simulation studies show the superiority of the proposed release policy on other related well-known release policies in the literature.
Keywords
integrated circuit manufacture; production planning; semiconductor device manufacture; semiconductor industry; hybrid MTS-MTO production; hybrid make-to-stock/make-to-order semiconductor manufacturing systems; production planning; re-entrancy feature; release policy; semiconductor fabrication; Electronic mail; Industrial engineering; Job shop scheduling; Manufacturing systems; Production control; Production planning; Production systems; Semiconductor device manufacture; Uncertainty; Workstations; Hybrid MTS/MTO; Make-To-Order; Make-To-Stock; Semiconductor Manufacturing Systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Developments in eSystems Engineering (DESE), 2009 Second International Conference on
Conference_Location
Abu Dhabi
Print_ISBN
978-1-4244-5401-3
Electronic_ISBN
978-1-4244-5402-0
Type
conf
DOI
10.1109/DeSE.2009.11
Filename
5395172
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