Title :
Solder life prediction in a thermal analysis software environment
Author :
Warner, Matt ; Parry, John ; Bailey, Chris ; Lu, Hua
Author_Institution :
Flomerics Ltd., Surrey, UK
Abstract :
This paper describes recent developments made to the stress analysis module within FLOTHERM, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an SMT resistor as an illustrative example. Lifetime predictions are made using the creep strain energy based models of Darveaux. Comment is made about the applicability of the damage model to the geometry of the joint under study.
Keywords :
ceramic packaging; creep; modules; plastic deformation; resistors; solders; stress analysis; surface mount technology; viscoplasticity; creep strain energy model; damage model; resistor; solder joint; solder life prediction; stress analysis module; thermal analysis software environment; viscoplastic properties; Assembly; Capacitive sensors; Computational fluid dynamics; Creep; Data models; Electromagnetic compatibility; Plastics; Soldering; Solid modeling; Thermal stresses;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
DOI :
10.1109/ITHERM.2004.1318309
