DocumentCode
3242303
Title
Solder life prediction in a thermal analysis software environment
Author
Warner, Matt ; Parry, John ; Bailey, Chris ; Lu, Hua
Author_Institution
Flomerics Ltd., Surrey, UK
Volume
2
fYear
2004
fDate
1-4 June 2004
Firstpage
391
Abstract
This paper describes recent developments made to the stress analysis module within FLOTHERM, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an SMT resistor as an illustrative example. Lifetime predictions are made using the creep strain energy based models of Darveaux. Comment is made about the applicability of the damage model to the geometry of the joint under study.
Keywords
ceramic packaging; creep; modules; plastic deformation; resistors; solders; stress analysis; surface mount technology; viscoplasticity; creep strain energy model; damage model; resistor; solder joint; solder life prediction; stress analysis module; thermal analysis software environment; viscoplastic properties; Assembly; Capacitive sensors; Computational fluid dynamics; Creep; Data models; Electromagnetic compatibility; Plastics; Soldering; Solid modeling; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN
0-7803-8357-5
Type
conf
DOI
10.1109/ITHERM.2004.1318309
Filename
1318309
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