• DocumentCode
    3242487
  • Title

    Process Variation Aware Issue Queue Design

  • Author

    Raghavendra, K. ; Mutyam, Madhu

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Chennai
  • fYear
    2008
  • fDate
    10-14 March 2008
  • Firstpage
    1438
  • Lastpage
    1443
  • Abstract
    In sub-90 nm process technology it becomes harder to control the fabrication process, which in turn causes variations between the design-time parameters and the fabricated parameters. Variations in the critical process parameters can result in significant fluctuations in the switching speed and leakage power consumption of different transistors in the same chip. In this paper, we study the impact of process variation on issue queues. Due to process variation, issue queues can take variable access latency. In order to work with nonuniform access latency issue queues, by exploiting ready operands of instructions at dispatch time, we propose a process variation aware issue queue design. Experimental results reveal that, for a 64-entry issue queue with half of the entries affected by process variation, our technique recovers most of the lost performance due to process variation and incurs a performance penalty of less than 2% with respect to the performance of issue queues without process variation.
  • Keywords
    integrated circuit design; integrated memory circuits; logic design; random-access storage; CAM; RAM; design-time parameters; fabrication process; issue queue design; leakage power consumption; process variation; switching speed; variable access latency; wakeup logic; CADCAM; Computer aided manufacturing; Delay; Energy consumption; Fluctuations; Logic design; Manufacturing processes; Performance loss; Pipelines; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe, 2008. DATE '08
  • Conference_Location
    Munich
  • Print_ISBN
    978-3-9810801-3-1
  • Electronic_ISBN
    978-3-9810801-4-8
  • Type

    conf

  • DOI
    10.1109/DATE.2008.4484876
  • Filename
    4484876