DocumentCode
3242680
Title
Electrothermal models of transistors based on finite element analysis for radar applications
Author
Raphael, Sommet ; Christophe, Chang ; Philippe, Dueme ; Raymond, Quere
Author_Institution
IRCOM, Limoges Univ., Brive la Gaillarde, France
Volume
2
fYear
2004
fDate
1-4 June 2004
Firstpage
515
Abstract
Electrothermal models of power devices are necessary for an accurate analysis of their performances. For this reason, this paper deals with the methodology to obtain an electrothermal model based for its thermal part on a reduced model of a three dimensional Finite Element (FE) thermal simulation and on electrical measurements for its electrical part. The reduced thermal model is based on a Ritz vectors approach and its equivalent SPICE subcircuit implementation. The complete model has been successfully implemented in the Advanced Design Simulator (ADS) for two kind of X band power amplifiers of 8 W class. One is based on TRIQUINT PHEMT transistors and the other on UMS HBT transistors. Coupled to a distributed electrical model, this electrothermal model has been used in order to investigate the behavior of these two High Power Amplifiers (HPAs) during radar pulses.
Keywords
III-V semiconductors; SPICE; electric variables measurement; equivalent circuits; finite element analysis; gallium arsenide; heterojunction bipolar transistors; power HEMT; power amplifiers; power bipolar transistors; pulse measurement; radar applications; semiconductor device models; 8 W; Advanced Design Simulator; GaAs; Ritz vectors; SPICE subcircuit implementation; TRIQUINT PHEMT transistors; UMS HBT transistors; X band power amplifiers; electrical measurement; endothermal models; finite element analysis; high power amplifiers; power device; radar applications; radar pulses; thermal simulation; transistor; Electric variables measurement; Electrothermal effects; Finite element methods; PHEMTs; Performance analysis; Power amplifiers; Pulse amplifiers; Radar applications; SPICE; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN
0-7803-8357-5
Type
conf
DOI
10.1109/ITHERM.2004.1318327
Filename
1318327
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