DocumentCode
3242779
Title
Enhanced thermal contact conductance using carbon nanotube arrays
Author
Xu, Jun ; Fisher, T.S.
Author_Institution
Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA
Volume
2
fYear
2004
fDate
1-4 June 2004
Firstpage
549
Abstract
Novel heat-conduction interfaces that employ carbon nanotube (CNT) arrays have been fabricated and studied experimentally. A reference calorimeter testing rig in a high vacuum environment with infrared temperature measurement has been established. Arrays of mat-type carbon nanotube layers have been grown directly on silicon substrates with microwave plasma-enhanced chemical vapor deposition. Iron and nickel are used as carbon nanotube catalysts. The thermal contact resistance of carbon nanotubes with a copper interface shows promising results with a minimum resistance of 23 mm2K/W at a pressure of 0.445 MPa. Carbon nanotube arrays grown under different synthesis parameters exhibit different pressure-contact conductance characteristics. CNT-copper interface thermal contact conductance could be improved by optimization of carbon nanotube array parameters. Combinations of thermal gels and phase change materials with CNT array composites are proposed for further thermal contact conductance reduction.
Keywords
carbon nanotubes; catalysts; copper; interface structure; iron; nickel; plasma CVD; scanning electron microscopy; thermal conductivity; 0.445 MPa; C-Cu; Fe; Ni; Si; calorimeter testing; carbon nanotube array composites; carbon nanotube catalysts; carbon nanotube-copper interface; enhanced thermal contact conductance; heat-conduction interfaces; infrared temperature measurement; iron; microwave plasma enhanced chemical vapor deposition; nickel; optimization; pressure-contact conductance; silicon substrates; thermal gels; Carbon nanotubes; Contact resistance; Electromagnetic heating; Microwave antenna arrays; Phased arrays; Silicon; Temperature measurement; Testing; Thermal conductivity; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN
0-7803-8357-5
Type
conf
DOI
10.1109/ITHERM.2004.1318332
Filename
1318332
Link To Document