• DocumentCode
    3242779
  • Title

    Enhanced thermal contact conductance using carbon nanotube arrays

  • Author

    Xu, Jun ; Fisher, T.S.

  • Author_Institution
    Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    549
  • Abstract
    Novel heat-conduction interfaces that employ carbon nanotube (CNT) arrays have been fabricated and studied experimentally. A reference calorimeter testing rig in a high vacuum environment with infrared temperature measurement has been established. Arrays of mat-type carbon nanotube layers have been grown directly on silicon substrates with microwave plasma-enhanced chemical vapor deposition. Iron and nickel are used as carbon nanotube catalysts. The thermal contact resistance of carbon nanotubes with a copper interface shows promising results with a minimum resistance of 23 mm2K/W at a pressure of 0.445 MPa. Carbon nanotube arrays grown under different synthesis parameters exhibit different pressure-contact conductance characteristics. CNT-copper interface thermal contact conductance could be improved by optimization of carbon nanotube array parameters. Combinations of thermal gels and phase change materials with CNT array composites are proposed for further thermal contact conductance reduction.
  • Keywords
    carbon nanotubes; catalysts; copper; interface structure; iron; nickel; plasma CVD; scanning electron microscopy; thermal conductivity; 0.445 MPa; C-Cu; Fe; Ni; Si; calorimeter testing; carbon nanotube array composites; carbon nanotube catalysts; carbon nanotube-copper interface; enhanced thermal contact conductance; heat-conduction interfaces; infrared temperature measurement; iron; microwave plasma enhanced chemical vapor deposition; nickel; optimization; pressure-contact conductance; silicon substrates; thermal gels; Carbon nanotubes; Contact resistance; Electromagnetic heating; Microwave antenna arrays; Phased arrays; Silicon; Temperature measurement; Testing; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
  • Print_ISBN
    0-7803-8357-5
  • Type

    conf

  • DOI
    10.1109/ITHERM.2004.1318332
  • Filename
    1318332