DocumentCode :
3243030
Title :
Heat conduction in micro-structured materials
Author :
Miyazaki, Koji ; Arashi, Toyotaka ; Tsukamoto, Hayami ; Song, David ; Chen, Gang
Author_Institution :
Dept. of Biol. Functions & Eng., Kyushu Inst. of Technol., Fukuoka, Japan
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
617
Abstract :
The numerical simulations of heat transfer in dielectric thin films with a micro-hole are conducted. Temperature profiles in the micro-structured materials were calculated using the equations of phonon radiative transfer (EPRT) in two dimensions based on the Boltzmann transport theory. It is well known that the classical Fourier law and the hyperbolic heat equation cannot be used to solve the heat transport at the microscopic area. In this study, we have investigated the effects of the hole size and the Knudsen number on the thermal conductivity of the micro-structured materials. When the hole size and the Knudsen number are increased, ballistic phonon transport becomes dominant. The modeling results show that it is possible to make micro-structured materials with thermal conductivity totally different from that suggested by the intrinsic properties.
Keywords :
Boltzmann equation; Knudsen flow; ballistic transport; dielectric materials; dielectric thin films; heat conduction; numerical analysis; phonons; radiative transfer; thermal conductivity; Boltzmann transport theory; Knudsen number; ballistic phonon transport; dielectric thin films; equations of phonon radiative transfer; heat conduction; heat transfer; hole size; intrinsic properties; microstructured materials; numerical simulations; temperature profiles; thermal conductivity; two dimension equation; Conducting materials; Dielectric materials; Dielectric thin films; Equations; Heat transfer; Microscopy; Numerical simulation; Phonons; Temperature; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
Type :
conf
DOI :
10.1109/ITHERM.2004.1318342
Filename :
1318342
Link To Document :
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