• DocumentCode
    3243204
  • Title

    Test Instrumentation for a Laser Scanning Localization Technique for Analysis of High Speed DRAM devices

  • Author

    Versen, Martin ; Schramm, Achim ; Schnepp, Jan ; Diaconescu, Dorina

  • Author_Institution
    Qimonda AG, Neubiberg
  • fYear
    2008
  • fDate
    10-14 March 2008
  • Firstpage
    776
  • Lastpage
    779
  • Abstract
    Soft defect localization (SDL) is a method of laser scanning microscopy that utilizes the changing pass/fail behavior of an integrated circuit under test and temperature influence. Historically the pass and fail states are evaluated by a tester that leads to long and impracticable measurement times for dynamic random access memories (DRAM). The new method using a high speed comparison device allows SDL image acquisition times of a few minutes and a localization of functional DRAM fails that are caused by defects in the DRAM periphery that has not been possible before. This new method speeds up significantly the turn-around time in the failure analysis (FA) process compared to knowledge based FA.
  • Keywords
    DRAM chips; failure analysis; high-speed integrated circuits; integrated circuit reliability; integrated circuit testing; measurement by laser beam; optical microscopy; dynamic random access memories; failure analysis; high speed DRAM devices; image acquisition; integrated circuit; laser scanning localization technique; laser scanning microscopy; soft defect localization; test instrumentation; Circuit testing; Electron microscopy; Electronic equipment testing; Failure analysis; Instruments; Integrated circuit testing; Random access memory; Scanning electron microscopy; Thermal resistance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe, 2008. DATE '08
  • Conference_Location
    Munich
  • Print_ISBN
    978-3-9810801-3-1
  • Electronic_ISBN
    978-3-9810801-4-8
  • Type

    conf

  • DOI
    10.1109/DATE.2008.4484909
  • Filename
    4484909