Title :
Liquid cooling high power compact electronics
Author :
Pfahnl, Andreas C. ; Liang, Hsing-Sheng
Author_Institution :
Teradyne Inc., Nashua, NH, USA
Abstract :
Conventional electronics liquid cooling are used in automatic test equipment (ATE) and military equipment, it is implemented using blind-mate fluid disconnects packaged alongside the card edge connectors, or using hoses and manual latching fluid disconnects. This paper describe a novel rack-mount liquid cooling packaging architecture. This arrangement utilizes manual latching fluid disconnects, so that the fluid transport lines to the electronics below are also front-side accessible. The system enables single or two-phase heat transfer between the fluid and the electronics as long as the heat load ensures only liquid passes to the pump. The liquid cooling system itself relies on the ambient air to dissipate the heat; it only transports the heat to a rack location where it easier to dissipate the heat.
Keywords :
cooling; heat pumps; heat sinks; power electronics; thermal management (packaging); automatic test equipment; blind mate fluid disconnects package; card edge connectors; fluid transport lines; heat dissipation; heat pump; hoses; liquid cooling system; manual latching fluid disconnects; military equipment; power compact electronics; rack mount liquid cooling packaging architecture; two phase heat transfer; Electronics packaging; Energy consumption; Heat pumps; Heat sinks; Liquid cooling; Military equipment; Packaging machines; Power dissipation; Switches; Wiring;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
DOI :
10.1109/ITHERM.2004.1318357