• DocumentCode
    3243402
  • Title

    Deep Submicron Interconnect Timing Model with Quadratic Random Variable Analysis

  • Author

    Jun-Kuei Zeng ; Chung-Ping Chen

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei
  • fYear
    2008
  • fDate
    10-14 March 2008
  • Firstpage
    1091
  • Lastpage
    1094
  • Abstract
    Shrinking feature sizes and process variations are of increasing concern in modern technology. It is urgent that we develop statistical interconnect timing models which are harmonious with the current trend in statistical timing analysis flow. Although statistical model order reduction techniques have been explored, the statistical interconnect timing model has not yet been fully analyzed. In this work, we develop a novel algorithm and its corresponding analysis for the statistical interconnect timing model, using second-order statistical variations to model the non-Gaussian distribution effects. As this model is fully congruous with current statistical static timing analysis with the canonical model and does not require any Monte Carlo simulation analysis, performance is greatly improved. Experimental results show that the proposed closed-form quadratic interconnect timing model is within 0.0046% error of the corresponding Monte Carlo simulation.
  • Keywords
    integrated circuit interconnections; random processes; statistical analysis; timing; canonical model; deep submicron interconnect timing model; non-Gaussian distribution effects; quadratic random variable analysis; second-order statistical variations; statistical timing analysis flow; Algorithm design and analysis; Closed-form solution; Distributed computing; Frequency domain analysis; Linear approximation; Performance analysis; Propagation delay; Random variables; Semiconductor device modeling; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe, 2008. DATE '08
  • Conference_Location
    Munich
  • Print_ISBN
    978-3-9810801-3-1
  • Electronic_ISBN
    978-3-9810801-4-8
  • Type

    conf

  • DOI
    10.1109/DATE.2008.4484922
  • Filename
    4484922