Refrigeration challenges in the next generation of computer, telecommunications and military electronic equipment

The application of vapor compression refrigeration to high performance, next generation electronic equipment cooling is ripe with challenge. Some challenges are specific to vapor compression refrigeration while others are challenges faced by many active cooling methods. Conversely, vapor compression refrigeration addresses many of the thermal challenges of high performance electronics particularly well. Obvious challenges include the ease of integration of the technology, the reliability, availability, cost and efficiency of the technology and for spot cooling, the design, operating range and thermal stability of the cold plate. An attempt will be made in this presentation to give an overview of these challenges associated with the application of vapor compression refrigeration to spot cooling of electronics and characterize the current state-of-the-art.