• DocumentCode
    3243657
  • Title

    The importance of computer architecture in microprocessor thermal design

  • Author

    Skadron, Kevin

  • Author_Institution
    Dept. of Comput. Sci., Virginia Univ., Charlottesville, VA, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    729
  • Abstract
    The microarchitecture has a unique role to play in maintaining continued performance growth, since it combines runtime knowledge of program behaviour with the ability to modify the hardware\´s behavior-both of which can be tracked and controlled at multiple granularities in space and time. A clear phase behavior in the SPECcpu2000 program mesa, as well as substantial temperature variation across different architectural units is shown. A dynamic compact model can be constructed using only information available in pre-RTL planning stages, namely architecture parameters, floorplan, and geometric and material properties of candidate packages. Thermal-RC pairs are constructed to represent heat flow in both the lateral and vertical directions. Power dissipation in each architecture unit is represented as a current source in the RC circuit and can be modeled using any architectural modeling tool, e.g. IBM\´s Power Timer. This model has been validated against Micred test chip to within 7% for both steady state and transient behavior and is boundary- and initial-condition independent (BICI). One example of "temperature-aware" architecture is dynamic thermal management (DTM) in conjunction with reducing packaging cost.
  • Keywords
    computer architecture; heat transfer; integrated circuit design; microprocessor chips; thermal management (packaging); IBM power timer; RC circuit; SPECcpu2000 program mesa; architectural modeling tool; architecture parameter; candidate package; computer architecture; cost reduction; dynamic compact model; dynamic thermal management; floorpan; geometric properties; heat flow; material properties; microprocessor thermal design; multiple granularity; power dissipation; runtime knowledge; temperature variation; Computer architecture; Hardware; Material properties; Microarchitecture; Microprocessors; Packaging; Runtime; Solid modeling; Temperature; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
  • Print_ISBN
    0-7803-8357-5
  • Type

    conf

  • DOI
    10.1109/ITHERM.2004.1318378
  • Filename
    1318378