DocumentCode :
3243979
Title :
Thermal performance of a plate-fin heat sink with a shield
Author :
Chao, Shung-Ming ; Li, Hung-Yi ; Yen, Yi-Feng ; Tsai, Go-Long
Author_Institution :
Dept. of Mechatron. Eng., Huafan Univ., Taipei, Taiwan
fYear :
2011
fDate :
27-29 May 2011
Firstpage :
230
Lastpage :
234
Abstract :
To assess the performance of plate-fin heat sinks with the introduction of a shield in a cross flow, we analyzed the surface temperature of the base of the heat sink with an infrared thermograph to determine the effects of shield, fin height, fin width and Reynolds number on the thermal resistance. The introduction of a shield decreases the bypass flow effect and forces more coolant fluid to enter the channel from fin to fin to enhance the heat transfer. Increasing the Reynolds number decreases the thermal resistance of the heat sink, but that decrease tends to diminish with increasing Reynolds number. For a given fin width, the thermal performance of the heat sink with the highest fins is superior. For a given fin height, the optimal fin width in terms of thermal performance increases with increasing Reynolds number.
Keywords :
flow; heat sinks; heat transfer; thermal engineering; thermal management (packaging); Reynolds number; bypass flow effect; coolant fluid; fin height; fin width; heat transfer; infrared thermograph; plate-fin heat sink; shield; surface temperature; thermal performance; thermal resistance; Infrared heating; Thermal analysis; Thermal management; infrared thermography; plate-fin heat sink; shield; thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Communication Software and Networks (ICCSN), 2011 IEEE 3rd International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-61284-485-5
Type :
conf
DOI :
10.1109/ICCSN.2011.6014886
Filename :
6014886
Link To Document :
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