DocumentCode :
3244500
Title :
An inverse geometry problem in determining the interfacial surfaces of a three layers structure based on the desired system heat flux
Author :
Huang, Cheng-Hung ; Wuchiu, Cheng-Tso ; Chen, Hsi-Mei
Author_Institution :
Dept. of Syst. & Naval Mechatron. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear :
2011
fDate :
27-29 May 2011
Firstpage :
348
Lastpage :
352
Abstract :
An optimum shape design problem in simultaneously designing the shapes of interfacial surfaces among three conductive bodies in a three-dimensional domain, based on the desired system heat flux and domain volume, is examined in the present work. The Levenberg-Marquardt method (LMM), B-Spline surface generation technique together with the commercial code CFD-ACE+ were utilized to solve the inverse geometry problem. The validity of this algorithm is examined using the numerical experiments. Different combinations of conductive bodies and desired system heat fluxes were given in the numerical test cases to justify the validity of the algorithm in solving the three-dimensional inverse design problem. Finally, it is concluded that when the interfacial surfaces are well designed, the effective system heat flux can be increased significantly.
Keywords :
computational fluid dynamics; heat conduction; inverse problems; numerical analysis; B-Spline surface generation technique; Levenberg-Marquardt method; commercial code CFD-ACE+; heat conduction; interfacial surface determination; interfacial surface shape analysis; inverse geometry problem; numerical method; optimum shape design problem; system heat flux analysis; three layer structure analysis; three-dimensional inverse design problem; Minimization; B-Spline surface generation; Interfacial surfaces estimation; Levenberg-Marquardt method; System heat flux maximization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Communication Software and Networks (ICCSN), 2011 IEEE 3rd International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-61284-485-5
Type :
conf
DOI :
10.1109/ICCSN.2011.6014910
Filename :
6014910
Link To Document :
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