DocumentCode :
3244644
Title :
Dielectric, rheological and calorimetric studies of silicones used in power modules
Author :
Jean-Pierre, H. ; Nadia, B. ; Emmanuel, D. ; Nathalie, M.
fYear :
2004
fDate :
8-10 Sept. 2004
Firstpage :
562
Lastpage :
566
Abstract :
This work deals with the characterization of the dielectric, rheological and calorimetric properties of different silicone formulations used in power device products such as power modules and inverters. The first part reports the dynamic and kinetic study of the crosslinking process. Important discrepancies are observed between the different compounds that enables a preselection of some polymers. Rheological and dielectric experiments performed on crosslinked samples aUow the final choice according to the desired application (encapsulafion of electronic circuits in power modules).
Keywords :
Dielectric devices; Dielectric materials; Dielectric substrates; Dielectrics and electrical insulation; Inverters; Kinetic theory; Multichip modules; Polymers; Rheology; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical and Electronics Engineering, 2004. (ICEEE). 1st International Conference on
Conference_Location :
Acapulco, Mexico
Print_ISBN :
0-7803-8531-4
Type :
conf
DOI :
10.1109/ICEEE.2004.1433948
Filename :
1433948
Link To Document :
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